Finetech will showcase packaging equipment at Semicon



Finetech will present its FINEPLACER ® system solution at Semicon China 2010. This is a device developed for high-end micro-assembly / optoelectronic packaging / professional SMD rework.

The multi-function placement machine FINEPLACER ® pico ma is designed for prototyping or small batch production, R&D and university research institutes. It has a flip chip accuracy of better than 5μm and a modular design that supports almost all semiconductor chip packaging processes. Suitable for all process transfer from R&D to production, with powerful process observation and feedback capabilities, process development is very easy and results are reliable. FINEPLACER ® pico ma can process components from 0.125 x 0.125 mm2 to 100 x 90 mm2 in a working area of ​​up to 450 x 122 mm. It supports up to 8 wafer substrates.

The sub-micron micro-assembly platform FINEPLACER ® lambda is modular in design and offers outstanding flexibility for easy reconfiguration and use in different applications. With a manual platform or semi-automatic configuration, it is ideal for small batch production, prototyping, education and R&D that are critical to process flexibility.

FINEPLACER ® lambda is capable of handling components from 0.07 x 0.07 mm2 to 60 x 90 mm2 over a working area of ​​up to 300 x 73 mm. It supports up to 6 wafer substrates. This economical chip soldering unit can handle a variety of complex processes including indium soldering, eutectic soldering, thermal/ultrasonic soldering, gluing processes, and exceptionally sensitive materials such as GaAs or GaP.

At this exhibition, FINETECH will focus on how laser bars can achieve sub-micron assembly. The platform is capable of independently performing all of the laser bar assembly process steps - including pick and roll of laser bars, transfer of substrates or heat sinks, and placement and soldering with inert gas or formic acid vapor protection.

The FINEPLACER ® assembly platform covers not only the entire range of optoelectronic and microelectronic applications, such as the assembly and soldering of VCSELs/photodiodes/LED/MEMS and MOEMS or micro-optics, but also unmatched placement accuracy and huge applications. Flexibility for successful application in the most complex 3D, multi-chip and wafer level package (W2W, C2W) tasks.

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