Lattice Semiconductor announces that Google's Advanced Technology and Projects (ATAP) team has adopted Lattice FPGA products in the ambitious Project Ara program to deliver the world's first modular smartphone , has a variety of modules for users to configure. The Module Developer Toolkit has been open to developers since last week. The toolkit is also the subject of the Project Ara Modular Developers Conference, which includes reference designs for removable modules. Project Ara's Lattice FPGA product with key interconnects between the basic skeletons of mobile phones.
Project Ara's head, Paul Eremenko, pointed out that one of Project Ara's main goals is to reduce the entry barrier for the smartphone hardware industry and significantly accelerate innovation by compressing development time. Lattice used Lattice FPGA products in the first prototype and MDK reference module design, mainly because they can meet the demanding requirements of size, power consumption and performance, as well as simplify and accelerate Project Ara's module played an important role in the development.
In addition, in order to enable enterprises to quickly develop prototypes based on Project Ara modules, low-power and small-sized Lattice FPGA products meet system requirements for heat-restricted environments, while providing great flexibility to support MIPI UniPro network protocol for inter-module interconnection. Lattice FPGA products provide proven solutions for mobile consumer electronics and are ideal for mass production modules. Developers can quickly put prototypes into volume production, reduce product development effort and speed time-to-market. The advantages of Lattice FPGA products have been proven in the hands of thousands of consumers around the world who are using smartphones.
Lattice FPGA products are now being used to increase battery life, achieve "always on-line" processing, and reduce system cost through flexible integration. These features are also what module developers need to build cost-effective modules that bring products to market faster than other semiconductor technologies.
The Project Ara prototype and reference design currently use the LatTIceECP3 FPGA in a small 10x10 mm package. Lattice's recently announced ECP5 FPGA product is designed to provide better I/O performance and flexibility while maintaining low cost, making it ideal for meeting the evolving MIPI UniPro interface standard.
In addition, Lattice's MachXO3 and iCE40 components are the world's smallest FPGAs, supplying millions of chips per day to major smartphone manufacturers, and module developers can use them to speed time-to-market and in small package sizes The flexibility required to meet a wide range of interconnect standards, such as DSI, CSI-2, SPI, I2C, and I2S, is achieved with the benefits of microwatt-level power consumption.
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