Ladon DSP/SOC Development Platform
The Ladon Development Kit system uses the SoC+DSP+Coprocessor architecture to provide users with a complete advanced hardware development environment with two high-performance FPGAs from Xilinx and a high-end DSP chip from Analog Devices.
The Ladon development board provides a rich set of external interfaces to meet the needs of most users, and a flexible expansion interface is reserved for applications such as ADC/DAC.
SoC+DSP+Coprocessor is the structure commonly used in complex high-performance systems in the industry. Early design and evaluation of system design through the Ladon Development Kit can significantly reduce design risk and shorten time-to-market.
The Ladon development board uses a Virtex4-FX60 as the SoC design platform, a TIgerSHARC-TS201S as the DSP design platform, and a Virtex4-SX55 as the Coprocessor design platform. The three main chips form the SoC+DSP+Coprocessor structure. The SoC mainly completes the system configuration, application and partial logic processing; the DSP chip completes the floating point and fixed-point DSP algorithm processing required by the system; the Coprocessor acts as a fixed-point DSP algorithm acceleration and other logic processing. Flexible bus interconnects between SoC, DSP, and Coprocessor for control and data transfer. The structure of this SoC+DSP+Coprocessor can meet the needs of designing and evaluating multiple systems.
• Figure 1 Ladon development board block diagram
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