LCD process---glass breaking device
LCD Process---Glass Breaking Device I. Introduction The LCD market has a continuous and rapid growth trend due to the demand for different uses such as IT industry (small cell) and TV (large cell). Therefore, in the large market, the substrate has a new specification of 1500 X 1800 mm or more and a thickness of 0.6 mm or less. In this way, in addition to the requirements of material innovation, the cost reduction for short-shrinking processes, etc., reforms must be made to adapt to changes in market demand. The following are the details of the breakthrough of the glass breaking technology of Samsung DIAMOND Industrial Co., Ltd. to meet the needs of the market. Second, the technical trend 2.1 panel breaking usually the panel is divided into cutting → flipping → split secondary secondary breaking (patented) operation. However, under the condition that the panel size is required to be large and thin, the area occupied by the turning mechanism and the bending at the time of turning affect the quality of the breaking edge portion, and further, the use of the platform? Brake Bar's machining accuracy problem Etc., it has faced bottlenecks in device design as expected. Therefore, using the patented and practically applied high-permeability cutter wheel "Pennet (a vertical crack that can reach more than 80% of the plate thickness), the upper and lower substrates can be simultaneously cut and developed without the need to flip. The system of disconnection (which may be referred to as separation from the previous point of view) has been adopted by several companies. At the same time, it was published in the 12th Planar Display Manufacturing Technology Exhibition in 2002. After that, the device was in the seventh. In the Advanced Display of the year (ADY2002), the company won the Excellence Award in the Manufacturing Equipment Division for the LCD rear-end engineering equipment. It is expected that the small panel will still use the conventional breaking device. With the continuous improvement of production in the future, the system is expected to be popular. It is applied to the large panel field such as TV. 2.2 The board breaks the board from the beginning of the bonding to the material stage. There are several processing projects, which cause the yield to be low due to the occurrence of particles. The solution to the problem has several unique technologies and is well received by the LINE equipment. 1 The breaking of the TFT Array substrate is called parti Cle-less bending method (patent pending), which is bent on the substrate before cutting, and the cutting is completed by vacuum suction to strengthen the degree of bending and then break it at once, due to the occurrence of particles, it does not It is characterized by the occurrence of horizontal cracks. 2 Although laser cutting is attracting attention in the market without the excellent cutting method of particles, there are still technical problems that cannot be solved, that is, it cannot be applied to the expected panel breaking, etc. However, in the case of cutting at the material stage, the effect of suppressing the occurrence of particles and improving the yield and strengthening the strength of the edge portion has been recognized and adopted one after another. In addition, the PDP is also considered to have the same effect and is used as an example. In short, the laser cutting depends on whether the inside of the material to be broken is skewed, and the effective range of the process compared with the cutting of the cutter wheel has its narrow weakness. III. Technical elements 3.1 The technology of the cutter wheel technology refers to the use of soft raw materials. Hard material to cut. This is one of the processing techniques commonly used by humans since the Stone Age. The basic principle of the project has not changed. The cutting of glass and other kiln products has been used for a long time like the diamond method. In the 15th century, with the development of glass technology, caster structure was attached. The glass cutting tool is gradually fixed. It is characterized by the fact that it does not require cutting costs and dry cutting. Due to the appearance of LCD, its advantages have attracted attention, and with the increasing use of high-tech applications, The technique that has not been valued so far will gradually have its place. Figure 2 is a schematic diagram of the formation of useful vertical cracks and harmful horizontal cracks due to cutting. Generally, the glass manufacturing process is first cooled by the surface layer and then melted inside. Due to the process of hardening and shrinking, the surface layer has high toughness due to compressive stress. Cutting is the effective separation of this high tough surface layer. In addition, as the glass material for LCDs is increasingly thinner, the maintenance of the corresponding product strength has become one of the important issues. In order to meet the needs of high toughness materials, sharpness consistent with material properties is required. Furthermore, because of the physical properties of the glass material, it is affected by the heat treatment of the LCD process, etc., although it is the same glass material, there may be a difference value due to the cutting conditions. In order to solve the above problems, the key is the cutter wheel material and the blade technology. It is very important to select the cutter wheel suitable for the breaking object. The company has always followed this technology trend and continuously developed cutter wheels suitable for new materials. In order to provide the best conditions, we hope that we can consult the company before your company plans for equipment. In addition, in order to maintain the long life (longevity) of the cutter wheel, it is closely related to the structure of the cutter wheel clamp, the design of the pressure control cutter head, etc., which will be provided together with the equipment and Know how technology. The above-mentioned high-permeability cutter wheel Pennet is also the same. 3.2 Laser cutting Although it caused sensational repercussions at the time of publication, the application of the most anticipated LCD panel at that time did not progress, and the application is still lagging behind. Because the relationship between the thermal stress and the internal friction of the material to be cut is used to solve this problem, the boundary of the thermal properties of the glass is reached, and the formation of vertical cracks is hindered; on the other hand, the cutter wheel is cut. The tension at the tip end of the vertical crack that must be formed does not exist, so when breaking, it takes about twice the breaking force than the cutter wheel to cut, and the breaking process condition is difficult to establish. Although there is still a problem in the division of the LCD panel, when the single board is cut, the occurrence of the particle can be greatly controlled, and the yield can be expected to be improved, and the effect of the edge portion strength as shown in FIG. 3 is obtained, so this method is started. use. In Figure 3, I hope everyone notices that there are three ways to break things that are cut by laser. Especially in Mode A, it can be inferred that the surface defect occurring at the disposal stage of the material is broken to the edge portion, where it is present at a maximum of 30%. However, if you are doing a sample, you will be bothered to reduce the percentage of cases. Regarding Mode A, B, there is still the possibility of reduction. Mode C, can infer the intensity of the virgin almost close to the glass, the starting point of the damage exists in the plane, and thus the smash is broken like an explosion. If, from the manufacturing stage of the material to the final product, it can be handled very well. If this mode is added, it may be possible to achieve laser cutting without the need of grinding. The defect is significantly higher than that of the conventional cutter wheel technology. Although there are still some tasks to be overcome in terms of panel breaking, laser cutting is a technology with great development possibilities, and we will continue to research and develop. Photo 2 is a laser cutting machine (display machine). IV. Postscript 4.1 Panel Breaking Effectively utilize the high-permeability cutter wheel Pennet technology, and establish the technology of dividing the upper and lower substrates at the same time that is considered impossible. The technology of breaking (separation) solves the technical problems of large-scale LCD breaking and realizes the cost. reduce. 4.2 Board Breaking The company has provided a variety of technical content and contributed to it. In the future, we plan to raise laser technology to contribute to the further development of FPD technology. The company has been involved in the manufacturing and development of the LCD glass breaking field for 25 years. During the period, I received many questions from various users and solved them together.
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Tingrui Electronics Technology Co., Ltd , http://www.jhflashlight.com